FISCHER ELEKTRONIK ICK BGA 35X35X10 Heat Sink, For Ball Grid Array, BGA, 15.7 °C/W, 10 mm, 35 mm, 35 mm Sachtler SC003 and a divider kit Accommodates

and a divider kit Accommodates Numerous combinations of cassettes

Angle-adjustable CNC machined aluminum construction

Lightweight ABS Backing Shell

The KanexPro Audio De-Embedder with HDMI Video Output extracts the audio signal from an HDMI input and outputs it through a TOSLINK

Temperature Coefficient ± 100ppm/°C Power Rating 100W Resistor Element Material Wirewound Resistance 1ohm Resistance Tolerance ± 5% Product Range WH Series Resistor Terminals Solder Lug Voltage Rating 1

FISCHER ELEKTRONIK ICK BGA 35X35X10 Heat Sink, For Ball Grid Array, BGA, 15.7 °C/W, 10 mm, 35 mm, 35 mm Sachtler SC003 and a divider kit AccommodatesThis is a Heat Sink, For Ball Grid Array, BGA, 15. 7 C W, 10 mm, 35 mm, 35 mm product from FISCHER ELEKTRONIK with the model number ICK BGA 35X35X10Product details Packages Cooled BGA Thermal Resistance 15. 7C W External Height Metric 10mm External Width Metric 35mm External Length Metric 35mm External Diameter Metric Heat Sink Material Aluminium External Height Imperial 0. 39" External Width Imperial 1. 38" External Length Imperial 1. 38" External