CCI CCI10 Heat Sink, BGA, FPGAs, Double Sided Adhesive, BGA, 9.12 °C/W, 6 mm, 38 mm, 38 mm Gra-Vue MIO HDSDI-FEXT focus or elevation tension springs

focus or elevation tension springs and baseboard feet

"Doctor Bag"-Style Opening

up to 3-5 frames per second

UPC: 698813002023

Windows Server 2012

CCI CCI10 Heat Sink, BGA, FPGAs, Double Sided Adhesive, BGA, 9.12 °C/W, 6 mm, 38 mm, 38 mm Gra-Vue MIO HDSDI-FEXT focus or elevation tension springsThis is a Heat Sink, BGA, FPGAs, Double Sided Adhesive, BGA, 9. 12 C W, 6 mm, 38 mm, 38 mm product from CCI with the model number CCI10Product details External Diameter Metric Packages Cooled BGA Heat Sink Material Aluminium Thermal Resistance 9. 12C W External Length Imperial 1. 5" External Length Metric 38mm External Width Metric 38mm External Diameter Imperial External Height Metric 6mm External Height Imperial 0. 24" External Width Imperial 1. 5"