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MULTICOMP 507-1409 Solder Wire, Lead Free, 1.2mm Diameter, 227°C, 250g Ergotron 33-341-200 The JP-A-FS7 Gold-Mount JetPack from

SKU 27670355137
4.7
USD3770.84 USD3806.84

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Ships within 48 hours · Estimated delivery Aug 10 - Aug 15

Description

The JP-A-FS7 Gold-Mount JetPack from Core SWX is a power connection option with various power outputs for your Sony FS7 camera

Inside Diameter Foam: 0

and multi selector

It delivers equivalent light to a 650W tungsten or 125 to 200W HMI source

Transformerless Noise Floor: -95 dBV typical Distortion Range

MULTICOMP 507-1409 Solder Wire, Lead Free, 1.2mm Diameter, 227°C, 250g Ergotron 33-341-200 The JP-A-FS7 Gold-Mount JetPack fromThis is a Solder Wire, Lead Free, 1. 2mm Diameter, 227C, 250g product from MULTICOMP with the model number 507 1409Product details Weight Metric 250g Flux Type No Clean and Rosin Flux Weight Imperial 8. 818oz Product Range Melting Temperature 227C Solder Alloy 99. 3, 0. 7 Sn, Cu External Diameter Imperial 0. 047" External Diameter Metric 1. 2mm Other details Brand MULTICOMP Part Number 507 1409 Quantity Reel of 1 Technical Data Sheet EN Safety Data

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
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